深圳医学科学院

岗位职责: 1. Hands-on PCB Design & Fabrication: Lead the end-to-end design of printed circuit boards (PCBs) tailored for IC chips, handle mixed digital/analog signal routing, including impedance-controlled routing where appropriate. Implement strict signal integrity (SI), power integrity (PI), grounding, and shieldingtechniques vital for microvolt-level neural signal isolation. 2. Fabrication & Assembly Oversight: Coordinate directly with external PCB foundries and assembly vendors. Oversee fabrication quality, manage component sourcing/BOMs, and assembly process control. Ensure compliance with defined validation procedures, yield targets, and quality standards. 3. System Testing & Bring-up: Perform rigorous board bring-up, hardware debugging, chip characterization to identify root causes and implement corrective actions. Validate system performance using oscilloscopes, logic analyzers, and custom test benches to ensure reliable data I/O routing. 4. Next-Gen System Support: Work closely with the research team to address immediate interface and hardware integration challenges, especially preparing for incoming future high-channel-count neural interface systems. 5. General Electronics Troubleshooting: Serve as the go-to technical expert for day-to-day lab electronics issues. Rapidly diagnose and resolve computer interface issues, data acquisition (DAQ) bottlenecks, and general hardware routing problems. 1. PCB 设计与制板实操：负责面向 IC 芯片的 PCB 全流程设计，包括数模混合信号布线（含阻抗控制布线），并严格执行信号完整性、电源完整性、接地及屏蔽设计，保障微伏级神经信号隔离； 2. 制板与组装监督：与外部 PCB 厂及组装厂商直接对接，监督制造质量、物料采购/BOM管理及组装工艺控制；确保符合既定的验证流程、良率目标及质量标准； 3. 系统测试与启动：执行严格的板级上电、硬件调试及芯片特性分析，定位根本原因并实施纠正措施；使用示波器、逻辑分析仪及定制测试台验证系统性能，确保数据 I/O路径的可靠传输； 4. 下一代系统支持：与研究团队紧密协作，解决当前接口与硬件集成的实际挑战，特别为未来即将引入的高通道神经接口系统做好技术准备； 5. 通用电子故障排查：担任实验室日常电子问题的技术专家，快速诊断并解决计算机接口、数据采集（DAQ）瓶颈及通用硬件路由问题。 任职资格: 1. MS degree in Electrical Engineering or related field. 2. Strong practical experience in PCB schematic design and layout for mixed-signal systems (e.g., using Altium Designer, Cadence Allegro, KiCad or similar tools). 3. Experience with PCB fabrication processes, assembly workflows, and vendor coordination. 4. Experience with board bring-up, debugging, and testing of IC-based electronic systems. 5. Experience with characterizing signal behavior across board traces, cables, connectors, and data I/O paths, such as high-speed differential-pair waveforms, eye-diagram measurements, signal integrity, timing analysis, and robust systemlevel data routing. 6. Deep understanding of analog/digital signal routing, impedance matching, grounding strategies, and EMI/noise reduction techniques. 7. Experience with CMOS IC interfacing and high-density I/O systems is strongly preferred. 8. Familiarity with oscilloscopes, logic analyzers, and general electronic debugging tools. 9. Experience with FPGA, DAQ systems, or high-speed interfaces is a plus. 10.Strong hands-on problem-solving skills and willingness to work closely with experimental researchers. 11.Ability to work full time in a collaborative interdisciplinary environment. 1. 电子工程或相关专业硕士学位； 2. 具备扎实的混合信号系统 PCB 原理图设计及版图布局实践经验（使用 AltiumDesigner、Cadence Allegro、KiCad 或类似工具）； 3. 熟悉 PCB 制程、组装流程及外协厂商协调工作； 4. 具有基于 IC 的电子系统的板级上电、调试及测试经验； 5. 具备板级走线、线缆、连接器及数据 I/O 通路上的信号特性分析经验，例如高速差分对波形、眼图测量、信号完整性、时序分析以及系统级数据路由的可靠性验证； 6. 具备对模拟/数字信号布线、阻抗匹配、接地策略及 EMI/噪声抑制技术的深入理解； 7. 熟悉示波器、逻辑分析仪及常用电子调试工具； 8. 具备扎实的动手解决问题能力，并乐于与实验研究人员密切协作； 9. 能够在多学科协作环境中全职工作； 10. 有 CMOS IC 接口及高密度 I/O 系统经验者优先； 11. 有 FPGA、DAQ 系统或高速接口经验者优先。